Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P400-1PQG208I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 55296 | |
| Number of I/O | 151 | |
| Number of Gates | 400000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 208-BFQFP | |
| Supplier Device Package | 208-PQFP (28x28) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P400-1PQG208I | |
| Related Links | M1A3P400, M1A3P400-1PQG208I Datasheet, Microsemi SoC Distributor | |
![]() | 1057088-1 | CONN N PLUG STR 50 OHM SOLDER | datasheet.pdf | |
![]() | LT1170IQ | IC REG MULT CONFIG INV ADJ DDPAK | datasheet.pdf | |
![]() | FI-XB30SSRL-HF16 | Connector Receptacle 30 Position 0.039" (1.00mm) Gold Board Edge, Cutout | datasheet.pdf | |
![]() | MC9S08JS16LCWJ | IC MCU 8BIT 16KB FLASH 20SOIC | datasheet.pdf | |
![]() | ECQ-E1824KFW | CAP FILM 0.82UF 10% 100VDC RAD | datasheet.pdf | |
![]() | RNC50J86R6FSB14 | RES 86.6 OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | Y4027122K809T0R | RES SMD 122.809K OHM 3/4W 2512 | datasheet.pdf | |
![]() | HIF5D-60DA-2.54R(71) | CONN HOUSING 60POS 2.54MM | datasheet.pdf | |
![]() | AMC25DTKT | CONN EDGECARD 50POS .100" | datasheet.pdf | |
![]() | AWHW-10G-0202-T | CONN HEADER LOW-PRO 10POS GOLD | datasheet.pdf | |
![]() | 416F30011ATT | CRYSTAL 30.000 MHZ 6PF SMT | datasheet.pdf | |
![]() | 1385207-2 | HDM 8SMPR070F080F K | datasheet.pdf |