Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL060-1FGG676I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 56520 | |
Total RAM Bits | 1869824 | |
Number of I/O | 387 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL060-1FGG676I | |
Related Links | M2GL060-, M2GL060-1FGG676I Datasheet, Microsemi SoC Distributor |
![]() | MCS04020C1741FE000 | RES SMD 1.74K OHM 1% 1/10W 0402 | datasheet.pdf | |
![]() | 1734215-4 | CONN MEMORY SCKT DIMM 184PS 15AU | datasheet.pdf | |
![]() | L-07C22NJV6T | FIXED IND 22NH 200MA 800 MOHM | datasheet.pdf | |
![]() | 8HM1-1 | HM HERMETICALLY SEALED BASIC SW | datasheet.pdf | |
![]() | 3120-F321-P7T1-W01Q-20A | CIR BRKR THRM 20A 250VAC 50VDC | datasheet.pdf | |
![]() | 156-00157 | FIR TREE W/8"L TIE BLACK | datasheet.pdf | |
![]() | 1460102 | CONN HOOD SIDE ENTRY SZB16 M25 | datasheet.pdf | |
![]() | 1N5224B-TR | DIODE ZENER 2.8V 500MW DO35 | datasheet.pdf | |
![]() | CRCW080521K0FHEAP | RES SMD 21K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | BFC2370GL681 | CAP FILM 680PF 10% 630VDC RADIAL | datasheet.pdf | |
![]() | 2M805-004-01NF15-37SA | M805 37C 37#23 SKT RECP THRD | datasheet.pdf | |
![]() | LQM18NNR47K10D | Capacitors Inductors Filters... | datasheet.pdf |