Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL060-1FGG676I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 56520 | |
| Total RAM Bits | 1869824 | |
| Number of I/O | 387 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL060-1FGG676I | |
| Related Links | M2GL060-, M2GL060-1FGG676I Datasheet, Microsemi SoC Distributor | |
![]() | PBC09DFBN | CONN HEADER .100 DUAL STR 18POS | datasheet.pdf | |
![]() | 381LQ331M315H452 | CAP ALUM 330UF 20% 315V SNAP | datasheet.pdf | |
![]() | C1608X5R1C334M080AA | CAP CER 0.33UF 16V X5R 0603 | datasheet.pdf | |
| 1792740 | TERM BLOCK HDR 3POS VERT 5.08MM | datasheet.pdf | ||
![]() | PX0411/03S/3540 | CONN HSNG RCPT IN-LINE 3POS SKT | datasheet.pdf | |
![]() | SMBJ5380A/TR13 | DIODE ZENER 120V 5W SMBJ | datasheet.pdf | |
![]() | 115-87-310-41-001101 | CONN IC DIP SOCKET 10POS GOLD | datasheet.pdf | |
![]() | 94611-425HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | MDM-25PH058B-A174 | MICRO 25C P 36" WHT NI | datasheet.pdf | |
![]() | TPSMB39CA | TVS DIODE 33.3VWM 53.9VC SMB AEQ | datasheet.pdf | |
![]() | APAM1348YD13V2.0 | ACTIVE INTRNL ANT 1575.42MHZ GPS | datasheet.pdf | |
![]() | CTV06RW-19-32JC-LC | CTV 32C 32#20 SKT PLUG | datasheet.pdf |