Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S050T-FG896I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 24 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 50K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 896-BGA | |
Supplier Device Package | 896-FBGA (31x31) | |
Number of I/O | 377 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S050T-FG896I | |
Related Links | M2S050T, M2S050T-FG896I Datasheet, Microsemi SoC Distributor |
![]() | W54-XB1A4A10-15 | CIR BRKR THRM 15A 250VAC | datasheet.pdf | |
![]() | LP3995ILD-3.0/NOPB | IC REG LDO 3V 0.15A 6WSON | datasheet.pdf | |
![]() | AD9432BSTZ-80 | IC ADC 12BIT 80MSPS 52-LQFP | datasheet.pdf | |
![]() | RNMF12FTD10K2 | RES 10.2K OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | C0603C472J9RALTU | CAP CER 4700PF 6.3V X7R 0603 | datasheet.pdf | |
![]() | 09670090413 | DSUB METAL-HOOD 09P TOPCE | datasheet.pdf | |
![]() | D4N-9231 | D4N-9231 | datasheet.pdf | |
![]() | UFT40020A | DIODE MODULE 200V 200A | datasheet.pdf | |
![]() | ATS-20E-25-C2-R0 | HEATSINK 60X60X25MM XCUT T766 | datasheet.pdf | |
![]() | ATS-11H-110-C3-R1 | HEATSINK 54X40X12.7MM XCUT T412 | datasheet.pdf | |
![]() | XC4028XL-1PG411I | IC FPGA 205 I/O 256BGA | datasheet.pdf | |
![]() | B9HC0117 | Capacitors Inductors Filters... | datasheet.pdf |