Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2S100-1FCG1152 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 512KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 100K Logic Modules | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FCBGA (35x35) | |
| Number of I/O | 574 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2S100-1FCG1152 | |
| Related Links | M2S100-, M2S100-1FCG1152 Datasheet, Microsemi SoC Distributor | |
![]() | 9T08052A2700DAHFT | RES SMD 270 OHM 0.5% 1/8W 0805 | datasheet.pdf | |
| VS-40EPF10PBF | DIODE GEN PURP 1KV 40A TO247AC | datasheet.pdf | ||
| UBT1J470MPD1TD | CAP ALUM 47UF 20% 63V RADIAL | datasheet.pdf | ||
![]() | RNC55H6601BSB14 | RES 6.6K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | TCBN-T1-M4-8-20 | BRD SPT SNAP LOCK SCREW MNT 20MM | datasheet.pdf | |
| CY-121VA-P-Z | SENSOR PHOTO PNP 100MM 12-24V | datasheet.pdf | ||
![]() | 350-10-113-00-013101 | CONN HDR 13POS T/H 0.100 GOLD | datasheet.pdf | |
![]() | 8N3SV76BC-0159CDI | IC OSC VCXO 100MHZ 6-CLCC | datasheet.pdf | |
![]() | ATS-09F-11-C2-R0 | HEATSINK 50X50X10MM XCUT T766 | datasheet.pdf | |
![]() | 7-146499-4 | 48 MODII HDR DRST UNSHRD STKG | datasheet.pdf | |
![]() | 165X11009XE | CONN BACKSHELL 9POSED C/W | datasheet.pdf | |
![]() | JT06RE18-66S | JT 66C 66#22D SKT PLUG | datasheet.pdf |