Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MBB02070C2409FCT00 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 5,000 | |
| Category | Resistors | |
| Family | Through Hole Resistors | |
| Series | MBB 0207 - Professional | |
| Packaging | Tape & Box (TB) | |
| Resistance (Ohms) | 24 | |
| Tolerance | ±1% | |
| Power (Watts) | 0.6W | |
| Composition | Thin Film | |
| Features | Automotive AEC-Q200 | |
| Temperature Coefficient | ±50ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | Axial | |
| Supplier Device Package | - | |
| Size / Dimension | 0.098" Dia x 0.256" L (2.50mm x 6.50mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MBB02070C2409FCT00 | |
| Related Links | MBB02070C, MBB02070C2409FCT00 Datasheet, Vishay/BCcomponents Distributor | |
![]() | GT11MAVBE | SWITCH TOGGLE SPDT 0.4VA 20V | datasheet.pdf | |
![]() | MCR10EZHJ364 | RES SMD 360K OHM 5% 1/8W 0805 | datasheet.pdf | |
![]() | 77081392P | RES ARRAY 7 RES 3.9K OHM 8SIP | datasheet.pdf | |
![]() | STB21NM60N | MOSFET N-CH 600V 17A D2PAK | datasheet.pdf | |
![]() | HI5760EVAL1 | EVALUATION PLATFORM SOIC HI5760 | datasheet.pdf | |
![]() | CYP15G0401DXB-BGI | IC TXRX HOTLINK 256LBGA | datasheet.pdf | |
| LA4032V-75TN48E | IC CPLD 32MC 7.5NS 48TQFP | datasheet.pdf | ||
![]() | 0702871223 | CONN HEADER BKWY DL GOLD 58POS | datasheet.pdf | |
![]() | IMN32188M12 | IPD M18 SHLD 3W SPST M12 | datasheet.pdf | |
![]() | 8SLVP2106ANLGI8 | IC CLK BUFFER 1:6 2GHZ 40QFN | datasheet.pdf | |
![]() | ATS-16H-92-C3-R0 | HEATSINK 40X40X15MM R-TAB T412 | datasheet.pdf | |
![]() | ATS-05C-117-C2-R0 | HEATSINK 45X45X10MM XCUT T766 | datasheet.pdf |