Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MBB02070D2801DC100 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Resistors | |
| Family | Through Hole Resistors | |
| Series | MBB 0207 - Professional | |
| Packaging | Tape & Box (TB) | |
| Resistance (Ohms) | 2.8k | |
| Tolerance | ±0.5% | |
| Power (Watts) | 0.6W | |
| Composition | Thin Film | |
| Features | - | |
| Temperature Coefficient | ±25ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | Axial | |
| Supplier Device Package | - | |
| Size / Dimension | 0.098" Dia x 0.256" L (2.50mm x 6.50mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MBB02070D2801DC100 | |
| Related Links | MBB02070D, MBB02070D2801DC100 Datasheet, Vishay/BCcomponents Distributor | |
![]() | 164J20 | XFRMR LAMINATED 36VA THRU HOLE | datasheet.pdf | |
![]() | MCR03EZPFX2673 | RES SMD 267K OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | 8655PHRA3701LF | BACKSHELL DB37 45DEG PLASTIC | datasheet.pdf | |
![]() | 2526-60K2UB | CONN HEADER 26POS STR GOLD T/H | datasheet.pdf | |
![]() | 1-6278414-6 | MT-RJ WRKST JACK SLATE 50/125 | datasheet.pdf | |
![]() | RSENC-DBLK-X2-U4 | ENCODER DYNAMIC REED SOLOMON XP2 | datasheet.pdf | |
![]() | 2982692 | TERM BLOCK | datasheet.pdf | |
![]() | 0828959 | TERMINAL MARKER YELLOW | datasheet.pdf | |
![]() | IEGH66-1-62-14.0-A-01-V | CIR BRKR MAG-HYDR LEVER 14A | datasheet.pdf | |
![]() | DSC1003CI5-087.5000 | OSC MEMS 87.5000MHZ CMOS SMD | datasheet.pdf | |
![]() | BFC246854684 | CAP FILM 680NF 5% 250VDC RAD | datasheet.pdf | |
![]() | XC3164A-3TQ144I | FPGA Field Programmable Gate Arrays (XC3000A/L, XC3100A/L) IC | datasheet.pdf |