NXP Semiconductors/Freescale Semiconductor, Inc. MC9S12C32MFAE25
- Mfg. Part Number
- MC9S12C32MFAE25
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 32KB FLASH 48LQFP
- Datasheet Download
- MC9S12C32MFAE25.pdf
Availability of MC9S12C32MFAE25
Available Quantity
5665 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 7.22400
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of MC9S12C32MFAE25, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MC9S12C32MFAE25 can be shipped within 24 hours after order. If you have any demands for MC9S12C32MFAE25, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- MC9S12C32MFAE25 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
MC9S12C32MFAE25
| Internal Part Number | EIS-MC9S12C32MFAE25 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Wirebond Material 28/May/2014 | |
| Standard Package | 500 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | HCS12 | |
| Packaging | Tray | |
| Core Processor | HCS12 | |
| Core Size | 16-Bit | |
| Speed | 25MHz | |
| Connectivity | CAN, EBI/EMI, SCI, SPI | |
| Peripherals | POR, PWM, WDT | |
| Number of I/O | 31 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.5 V | |
| Data Converters | A/D 8x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 48-LQFP | |
| Supplier Device Package | 48-LQFP (7x7) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC9S12C32MFAE25 | |
| Related Links | MC9S12C, MC9S12C32MFAE25 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
MC9S12C32MFAE25 Details Description
Related parts for MC9S12C32MFAE25
 | SN74AUC1G240YEPR | IC INVERTER 1-INPUT 5DSBGA | datasheet.pdf | |
 | AT25020A-10TI-2.7 | IC EEPROM 2KBIT 20MHZ 8TSSOP | datasheet.pdf | |
 | 0318.125HXP | FUSE GLASS 125MA 250VAC 3AB 3AG | datasheet.pdf | |
 | CPT400100 | DIODE MODULE 100V 200A 2TOWER | datasheet.pdf | |
 | FXO-HC738-250 | OSC XO 250.000MHZ HCMOS SMD | datasheet.pdf | |
 | 3020-40-0300-00 | IDC BOX HEADER .100" 40POS | datasheet.pdf | |
 | 50ZLJ27MTA5X11 | CAP ALUM 27UF 20% 50V RADIAL | datasheet.pdf | |
 | 5856 GR001 | HOOK-UP STRND 20AWG GREEN 1000' | datasheet.pdf | |
 | E36D101HPN683MED0M | CAP ALUM 68000UF 20% 100V SCREW | datasheet.pdf | |
 | 890-70-011-20-002101 | CONN HDR 11POS 2.54MM T/H R/A | datasheet.pdf | |
| 09670159160 | D SUB 15P MA ANG_S4_2,84 MM_BOAR | datasheet.pdf | |
| ATS-05B-90-C2-R0 | HEATSINK 35X35X35MM R-TAB T766 | datasheet.pdf |