NXP Semiconductors/Freescale Semiconductor, Inc. MC9S12GC32MPBE
- Mfg. Part Number
- MC9S12GC32MPBE
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 32KB FLASH 52LQFP
- Datasheet Download
- MC9S12GC32MPBE.pdf
Availability of MC9S12GC32MPBE
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 6.25200
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of MC9S12GC32MPBE, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MC9S12GC32MPBE can be shipped within 24 hours after order. If you have any demands for MC9S12GC32MPBE, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- MC9S12GC32MPBE Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
MC9S12GC32MPBE
| Internal Part Number | EIS-MC9S12GC32MPBE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Wirebond Material 28/May/2014 | |
| Standard Package | 640 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | HCS12 | |
| Packaging | Tray | |
| Core Processor | HCS12 | |
| Core Size | 16-Bit | |
| Speed | 25MHz | |
| Connectivity | EBI/EMI, SCI, SPI | |
| Peripherals | POR, PWM, WDT | |
| Number of I/O | 35 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.5 V | |
| Data Converters | A/D 8x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 52-LQFP | |
| Supplier Device Package | 52-LQFP (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC9S12GC32MPBE | |
| Related Links | MC9S12G, MC9S12GC32MPBE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
MC9S12GC32MPBE Details Description
Related parts for MC9S12GC32MPBE
 | A-MCU60100 | CABLE CAT6 UNSHIELDED GRAY 10M | datasheet.pdf | |
 | 208457030002025 | CONNECTOR RECEPT 30POS STR | datasheet.pdf | |
| 961106-6700-AR-PR | CONN HEADER VERT 6POS GOLD SMD | datasheet.pdf | |
 | TNPU0603169RBZEN00 | RES SMD 169 OHM 0.1% 1/10W 0603 | datasheet.pdf | |
 | 70-841-027 | LPQ200-M CONNECTOR KIT | datasheet.pdf | |
| VE-262-CU | CONVERTER MOD DC/DC 15V 200W | datasheet.pdf | |
 | RNC50J1912BSBSL | RES 19.1K OHM 1/10W .1% AXIAL | datasheet.pdf | |
| 3120-F311-P7T1-W15FY0-5A | CIR BRKR THRM 5A 250VAC 50VDC | datasheet.pdf | |
| 426-83-226-41-002101 | Connector Socket 26 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
| ABC43DRSS-S288 | CONN EDGECARD 86POS .100" | datasheet.pdf | |
| ATS-05D-32-C2-R0 | HEATSINK 57.9X36.83X11.43MM T766 | datasheet.pdf | |
 | MA74101CBN | HIGH FREQUENCY CERAMIC CAPACITORS | datasheet.pdf |