Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCF5272VF66 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Obsolescence/ EOL | Multiple Devices 13/Nov/2012 | |
| PCN Design/Specification | Copper Bond Wire 06/Jan/2015 | |
| Standard Package | 630 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | MCF527x | |
| Packaging | Tray | |
| Core Processor | Coldfire V2 | |
| Core Size | 32-Bit | |
| Speed | 66MHz | |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | |
| Peripherals | DMA, WDT | |
| Number of I/O | 32 | |
| Program Memory Size | 16KB (4K x 32) | |
| Program Memory Type | ROM | |
| EEPROM Size | - | |
| RAM Size | 1K x 32 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | - | |
| Oscillator Type | External | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 196-LBGA | |
| Supplier Device Package | 196-MAPBGA (15x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCF5272VF66 | |
| Related Links | MCF52, MCF5272VF66 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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