Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCIMX6D5EYM10AC | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | i.MX 6 Series Applications Processors Introduction | |
PCN Design/Specification | I.MX 6DUAL6QUAD Update 04/Jun/2013 I.MX 6Dual/6Quad Errata Update 11/Dec/2013 I.MX6DQ Rev 1.3 Errata Revision 28/Jan/2014 I.MX6 Datasheet Update 01/May/2014 Reference Manual Update 01/Aug/2014 Design Change 01/Aug/2014 Errata Update 01/Jul/2015 Datasheet Correction 16/Nov/2015 | |
PCN Assembly/Origin | i.MX6Q/D Assembly Site 24/Jan/2014 Assembly Site Addition 05/Mar/2015 Reference Manual Update 28/Jul/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 300 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | i.MX6D | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-A9 | |
Number of Cores/Bus Width | 2 Core, 32-Bit | |
Speed | 1.0GHz | |
Co-Processors/DSP | Multimedia; NEON™ SIMD | |
RAM Controllers | LPDDR2, LVDDR3, DDR3 | |
Graphics Acceleration | Yes | |
Display & Interface Controllers | Keypad, LCD | |
Ethernet | 10/100/1000 Mbps (1) | |
SATA | SATA 3Gbps (1) | |
USB | USB 2.0 + PHY (4) | |
Voltage - I/O | 1.8V, 2.5V, 2.8V, 3.3V | |
Operating Temperature | -20°C ~ 105°C | |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | |
Package / Case | 624-FBGA, FCBGA | |
Supplier Device Package | 624-FCBGA (21x21) | |
Additional Interfaces | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCIMX6D5EYM10AC | |
Related Links | MCIMX6D, MCIMX6D5EYM10AC Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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