Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP212XEV-DB | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation and Demonstration Boards and Kits | |
| Series | - | |
| Main Purpose | Interface, Infrared Transceiver | |
| Embedded | - | |
| Utilized IC / Part | MCP2120, MCP2122 | |
| Primary Attributes | - | |
| Secondary Attributes | - | |
| Supplied Contents | Board | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP212XEV-DB | |
| Related Links | MCP212, MCP212XEV-DB Datasheet, Microchip Technology Distributor | |
![]() | 9019300000 | FERRULE 25.0MM 36 YLW 1 = 50PCS | datasheet.pdf | |
![]() | 812-22-033-30-009101 | CONN SPRING 33POS SNGL .430 SMD | datasheet.pdf | |
![]() | RCC28DRTI-S93 | CONN EDGECARD 56POS DIP .100 SLD | datasheet.pdf | |
![]() | 893D106X9035D2TE3 | CAP TANT 10UF 35V 10% 2917 | datasheet.pdf | |
![]() | SN74LV10APWTE4 | IC GATE NAND 3CH 3-INP 14-TSSOP | datasheet.pdf | |
![]() | SLP102M250E9P3 | CAP ALUM 1000UF 20% 250V SNAP | datasheet.pdf | |
![]() | RMCP2010FT5K90 | RES SMD 5.9K OHM 1% 1W 2010 | datasheet.pdf | |
![]() | D38999/24FE6HN | CONN RCPT 6POS JAM NUT W/PINS | datasheet.pdf | |
![]() | ATS-12E-37-C2-R0 | HEATSINK 36.83X57.6X17.78MM T766 | datasheet.pdf | |
![]() | VJ0603D4R3BLPAJ | CAP CER 4.3PF 250V NP0 0603 | datasheet.pdf | |
![]() | BFC237679912 | CAP FILM 9.1NF 3.5% 1000VDC RAD | datasheet.pdf | |
![]() | LPS-RK-2/10SP | LOW-PEAK DUAL ELEMENT | datasheet.pdf |