Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP2210-I/MQ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | MCP2210 Evaluation Kit Overview | |
| PCN Design/Specification | Mold Compound Update 31/Oct/2014 | |
| PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 73 | |
| Category | Integrated Circuits (ICs) | |
| Family | Interface - Controllers | |
| Series | - | |
| Packaging | Tube | |
| Protocol | USB | |
| Function | Bridge, USB to SPI | |
| Interface | SPI | |
| Standards | USB 2.0 | |
| Voltage - Supply | 3.3 V ~ 5.5 V | |
| Current - Supply | 13mA | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 20-VQFN Exposed Pad | |
| Supplier Device Package | 20-QFN (5x5) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP2210-I/MQ | |
| Related Links | MCP221, MCP2210-I/MQ Datasheet, Microchip Technology Distributor | |
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