Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCP2210-I/MQ | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | MCP2210 Evaluation Kit Overview | |
PCN Design/Specification | Mold Compound Update 31/Oct/2014 | |
PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 73 | |
Category | Integrated Circuits (ICs) | |
Family | Interface - Controllers | |
Series | - | |
Packaging | Tube | |
Protocol | USB | |
Function | Bridge, USB to SPI | |
Interface | SPI | |
Standards | USB 2.0 | |
Voltage - Supply | 3.3 V ~ 5.5 V | |
Current - Supply | 13mA | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 20-VQFN Exposed Pad | |
Supplier Device Package | 20-QFN (5x5) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCP2210-I/MQ | |
Related Links | MCP221, MCP2210-I/MQ Datasheet, Microchip Technology Distributor |
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