Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP6023-I/SN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 | |
| PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 100 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tube | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 1 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 7 V/µs | |
| Gain Bandwidth Product | 10MHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 500µV | |
| Current - Supply | 1mA | |
| Current - Output / Channel | 30mA | |
| Voltage - Supply, Single/Dual (±) | 2.5 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOIC N | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP6023-I/SN | |
| Related Links | MCP602, MCP6023-I/SN Datasheet, Microchip Technology Distributor | |
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