Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCR10EZHJ913 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 5,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | MCR | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 91k | |
| Tolerance | ±5% | |
| Power (Watts) | 0.125W, 1/8W | |
| Composition | Thick Film | |
| Features | - | |
| Temperature Coefficient | ±200ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | 0805 (2012 Metric) | |
| Supplier Device Package | 0805 (2012 Metric) | |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
| Height | 0.024" (0.60mm) | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCR10EZHJ913 | |
| Related Links | MCR10E, MCR10EZHJ913 Datasheet, Rohm Semiconductor Distributor | |
![]() | EE80C188XL25 | IC MPU I186 25MHZ 68PLCC | datasheet.pdf | |
![]() | PDL-6556-2 | LABEL S LAM DM VNL WH 0.60X1.44" | datasheet.pdf | |
![]() | MT18LSDT6472AY-133D2 | MODULE SDRAM 512MB 168-DIMM | datasheet.pdf | |
![]() | SI32268-C-FM | IC PROSLIC FXS DUAL -110V 50QFN | datasheet.pdf | |
![]() | B43505A9397M2 | CAP ALUM 390UF 20% 400V SNAP | datasheet.pdf | |
![]() | CL31A226KOHNNNE | CAP CER 22UF 16V X5R 1206 | datasheet.pdf | |
![]() | EPF10K130EBC600-2X | IC FPGA 424 I/O 600BGA | datasheet.pdf | |
![]() | N25Q064A13ESF42G | IC FLASH 64MBIT 108MHZ SOIC | datasheet.pdf | |
![]() | 79425-432HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | VBM511-75-1502 | CONN BNC JACK R/A 75 OHM SOLDER | datasheet.pdf | |
![]() | FLDWD0311-12-3 | HOOK-UP CABLE STRANDED | datasheet.pdf | |
![]() | 97-3106A20-14SZ | AB 5C 3#12, 2#8 SKT PLUG | datasheet.pdf |