Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCU08050D6201BP100 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | MCU 0805 - Precision | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 6.2k | |
| Tolerance | ±0.1% | |
| Power (Watts) | 0.125W, 1/8W | |
| Composition | Thin Film | |
| Features | - | |
| Temperature Coefficient | ±25ppm/°C | |
| Operating Temperature | -55°C ~ 125°C | |
| Package / Case | 0805 (2012 Metric) | |
| Supplier Device Package | 0805 | |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
| Height | 0.022" (0.55mm) | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCU08050D6201BP100 | |
| Related Links | MCU08050D, MCU08050D6201BP100 Datasheet, Vishay/BCcomponents Distributor | |
![]() | 3ABP 2.5 | FUSE CERAMIC 2.5A 250VAC 3AB 3AG | datasheet.pdf | |
![]() | IHLP5050FDERR33M01 | FIXED IND 330NH 46A 0.9 MOHM SMD | datasheet.pdf | |
![]() | 93690-103-08LF | BERGSTIK | datasheet.pdf | |
![]() | LPX471M350E4P3 | CAP ALUM 470UF 20% 350V SNAP | datasheet.pdf | |
![]() | LA60Q402 | FUSE SEMICONDUCTOR 40A 600VAC | datasheet.pdf | |
![]() | 0752352128 | CONN HEADER BACKPLANE 80POS GOLD | datasheet.pdf | |
![]() | VI-26J-EX-B1 | CONVERTER MOD DC/DC 36V 75W | datasheet.pdf | |
![]() | CA3100R24-28P | CONN RCPT 24POS WALL MNT W/PINS | datasheet.pdf | |
![]() | ATSAM4E-EK | EVAL KIT FOR SAM4E CORTEX | datasheet.pdf | |
![]() | C1005C0G1H271K050BA | CAP CER 270PF 50V C0G 0402 | datasheet.pdf | |
![]() | MAX3294AUT+TCGD | IC DRIVER RS485/422 SOT23-6 | datasheet.pdf | |
![]() | 322A434-25-0 | MOLDED PARTS | datasheet.pdf |