Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MK50DN512CMC10 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | KINETIS K, L, COLDFIRE+ Errata Update 17/Oct/2013 Mask Revision and Errata Update 16/Jan/2014 | |
PCN Assembly/Origin | Site Chg 09/Dec/2015 | |
Standard Package | 348 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | Kinetis K50 | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-M4 | |
Core Size | 32-Bit | |
Speed | 100MHz | |
Connectivity | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | |
Peripherals | DMA, I²S, LVD, POR, PWM, WDT | |
Number of I/O | 78 | |
Program Memory Size | 512KB (512K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 128K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.71 V ~ 3.6 V | |
Data Converters | A/D 27x16b, D/A 2x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 121-LFBGA | |
Supplier Device Package | 121-MAPBGA (8x8) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MK50DN512CMC10 | |
Related Links | MK50DN5, MK50DN512CMC10 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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