Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MKL02Z16VFG4R | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | KL02 Series Datasheet Update 24/Apr/2014 Datasheet Update 16/Sep/2014 | |
PCN Assembly/Origin | Assembly Site Expansion 23/Jan/2015 Assembly Site Revision A 26/Feb/2015 | |
PCN Other | MPQ Update 13/Jan/2015 | |
Standard Package | 5,000 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | Kinetis KL02 | |
Packaging | Tape & Reel (TR) | |
Core Processor | ARM® Cortex®-M0+ | |
Core Size | 32-Bit | |
Speed | 48MHz | |
Connectivity | I²C, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
Number of I/O | 14 | |
Program Memory Size | 16KB (16K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 2K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.71 V ~ 3.6 V | |
Data Converters | A/D 6x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 105°C | |
Package / Case | 16-WFQFN Exposed Pad | |
Supplier Device Package | 16-QFN (3x3) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MKL02Z16VFG4R | |
Related Links | MKL02Z, MKL02Z16VFG4R Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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