Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MKL27Z64VDA4 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | MKL27/MKL17 Ref Manual Update Rev 3 to Rev 4 23/Oct/2015 | |
| Standard Package | 490 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Kinetis KL2 | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M0+ | |
| Core Size | 32-Bit | |
| Speed | 48MHz | |
| Connectivity | I²C, FlexIO, SPI, UART/USART, USB | |
| Peripherals | DMA, I²S, PWM, WDT | |
| Number of I/O | 30 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 16K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.71 V ~ 3.6 V | |
| Data Converters | A/D 14x16b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 36-XFBGA | |
| Supplier Device Package | 36-XFBGA (3.5x3.5) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MKL27Z64VDA4 | |
| Related Links | MKL27Z, MKL27Z64VDA4 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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