Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MLG0402Q-1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | High Frequency Inductor Family | |
| Featured Product | MLCC, Inductor, and Ferrite Bead Engineering Sample Kits | |
| Standard Package | 1 | |
| Category | Kits | |
| Family | Inductors Kits | |
| Series | MLG-Q | |
| Packaging | Plastic Box with Bin Guide | |
| Kit Type | Ceramic Chip | |
| Values | 600 pcs - 20 ea of 1.0nH ~ 3.9nH | |
| Mounting Type | Surface Mount | |
| Packages Included | 01005 (0402 Metric) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MLG0402Q-1 | |
| Related Links | MLG04, MLG0402Q-1 Datasheet, TDK Corporation Distributor | |
![]() | ERJ-S14F3902U | RES SMD 39K OHM 1% 1/2W 1210 | datasheet.pdf | |
![]() | RG3216P-2201-C-T5 | RES SMD 2.2K OHM 0.25% 1/4W 1206 | datasheet.pdf | |
![]() | ESA32DTAH | CONN EDGECARD 64POS R/A .125 SLD | datasheet.pdf | |
![]() | RMM12DRKF | CONN EDGECARD 24POS DIP .156 SLD | datasheet.pdf | |
![]() | CD74HCT40105M96G4 | IC FIFO REGISTER 4X16 16SOIC | datasheet.pdf | |
![]() | 3049408 | BOLT CONNECTION TERM BLOCK GRAY | datasheet.pdf | |
![]() | CMF65R49900FNEK | RES 0.499 OHM 1.5W 1% AXIAL | datasheet.pdf | |
![]() | CD214A-FS1200 | DIODE CHIP | datasheet.pdf | |
![]() | 1718647 | TERM BLOCK | datasheet.pdf | |
![]() | ATS-15H-112-C3-R1 | HEATSINK 60X40X12.7MM XCUT T412 | datasheet.pdf | |
![]() | FPE140BE25238BJ1 | CAP CER 2500PF 5KV R85 | datasheet.pdf | |
![]() | XC7V2000T-L2FLG1925C | Field Programmable Gate Array, 152700 CLBs, PBGA1925 IC | datasheet.pdf |