Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MPC5566MZP144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | MPC55xx Errata MPC55xx 18UM Au Wire 22/Oct/2013 Copper Wire Conversion 30/Mar/2015 | |
| PCN Assembly/Origin | Burn-In Optimization 01/Aug/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 200 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | MPC55xx Qorivva | |
| Packaging | Tray | |
| Core Processor | e200z6 | |
| Core Size | 32-Bit | |
| Speed | 144MHz | |
| Connectivity | CAN, EBI/EMI, Ethernet, SCI, SPI | |
| Peripherals | DMA, POR, PWM, WDT | |
| Number of I/O | 256 | |
| Program Memory Size | 3MB (3M x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 128K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.35 V ~ 1.65 V | |
| Data Converters | A/D 40x12b | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 416-BBGA | |
| Supplier Device Package | 416-PBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MPC5566MZP144 | |
| Related Links | MPC556, MPC5566MZP144 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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