Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27467T13B4S-CG | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27467T13B4S-CG | |
| Related Links | MS27467T, MS27467T13B4S-CG Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | SMBJ51A | TVS DIODE 51VWM 82.4VC SMB | datasheet.pdf | |
![]() | MAX1481EUB+T | IC TXRX RS485/RS422 10-UMAX | datasheet.pdf | |
![]() | TGL41-100A-E3/96 | TVS DIODE 85.5VWM 137VC MELF | datasheet.pdf | |
![]() | 4700-26EW30BB999 | XFRMR LAMINATED 80VA CHAS MOUNT | datasheet.pdf | |
![]() | RN50C6492FBSL | RES 64.9K OHM 1/20W 1% AXIAL | datasheet.pdf | |
![]() | 6022R-016 | XFRMR LAMINATED 1.1VA THRU HOLE | datasheet.pdf | |
![]() | ATS-18F-82-C2-R0 | HEATSINK 30X30X25MM R-TAB T766 | datasheet.pdf | |
![]() | MDM-25SH008P-A174 | MICRO 25C S 12" WHT JACKP NI | datasheet.pdf | |
![]() | PIC32MX270F256DT-V/TL | IC MCU 32BIT 256KB FLASH 44VTLA | datasheet.pdf | |
![]() | SQL48T20033-PDA0G | DC/DC CONVERTER 3.3V 66W | datasheet.pdf | |
![]() | ACA3100FA14S-7SBY | ACB 3C 3#16S SKT RECP WALL | datasheet.pdf | |
![]() | LQH3N2R7K34M00-01 | Capacitors Inductors Filters... | datasheet.pdf |