Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27467T17F26P-USHST3 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27467T17F26P-USHST3 | |
| Related Links | MS27467T17, MS27467T17F26P-USHST3 Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | VR68000001005JAC00 | RES 10M OHM 1W 5% AXIAL | datasheet.pdf | |
| 1788716 | TERM BLOCK RCPT 20POS 5.08MM | datasheet.pdf | ||
![]() | RN60C4122BBSL | RES 41.2K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | ISPLSI 2032VE-300LTN48 | IC CPLD 32MC 3NS 48TQFP | datasheet.pdf | |
![]() | CMF553K3000FEEA | RES 3.3K OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | 6059C SL002 | MULTI-PAIR 18COND 22AWG 500' | datasheet.pdf | |
![]() | 5SGXMB6R2F43C2LN | IC FPGA 600 I/O 1760FBGA | datasheet.pdf | |
![]() | ATS-17A-134-C2-R0 | HEATSINK 70X70X15MM XCUT T766 | datasheet.pdf | |
![]() | OQ23155000J0G | 350 TB SOCKET WF VER | datasheet.pdf | |
![]() | CTVP00RW-17-35HE-LC | CTV 55C 55#22D PIN RECP | datasheet.pdf | |
![]() | D38999/20WJ4HB-LC | CONN HSG RCPT FLANGE 56POS PIN | datasheet.pdf | |
![]() | MAL215661682E3 | 6800UF 50V 30X30MM 85C 5000H | datasheet.pdf |