Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27467T9B98BD | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27467T9B98BD | |
| Related Links | MS27467, MS27467T9B98BD Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | 34964 | CONN RING 10-12 AWG #10 BUDGET | datasheet.pdf | |
![]() | 961115-6700-AR-TP | CONN HEADER VERT 15POS GOLD SMD | datasheet.pdf | |
![]() | VI-23X-EY-B1 | CONVERTER MOD DC/DC 5.2V 50W | datasheet.pdf | |
![]() | RWR74S2050FSB12 | RES 205 OHM 5W 1% WW AXIAL | datasheet.pdf | |
![]() | 995221 | LP 5.08/135/9 OG | datasheet.pdf | |
![]() | 830-80-048-10-001101 | CONN HDR 48POS 2MM T/H | datasheet.pdf | |
![]() | 853-87-094-30-002101 | Connector Socket 94 Position 0.050" (1.27mm) Gold Surface Mount | datasheet.pdf | |
![]() | EP3SE110F780C4LNES | IC FPGA 488 I/O 780FBGA | datasheet.pdf | |
![]() | FH28-40(20)SB-1SH(11) | CONN FPC BOTTOM 40POS 1.00MM R/A | datasheet.pdf | |
![]() | S25FL132K0XMFIQ13 | IC FLASH 32MBIT | datasheet.pdf | |
![]() | HMC635 | IC MMIC POWER AMP DIE | datasheet.pdf | |
![]() | 2-87964-9 | 60 MODII HORZ DR CE 100CL/145 | datasheet.pdf |