Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT9VDDF3272G-265G3 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 100 | |
| Category | Memory Cards, Modules | |
| Family | Memory - Modules | |
| Series | - | |
| Memory Type | DDR SDRAM | |
| Memory Size | 256MB | |
| Speed | 266MT/s | |
| Package / Case | 184-DIMM | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT9VDDF3272G-265G3 | |
| Related Links | MT9VDDF32, MT9VDDF3272G-265G3 Datasheet, Micron Technology Distributor | |
![]() | TP3410J304/NOPB | IC TRANSCEIVER MONOLITHIC 28CDIP | datasheet.pdf | |
![]() | NPTC091KFXC-RC | Connector Header 9 Position 0.100" (2.54mm) Tin Surface Mount | datasheet.pdf | |
![]() | ECQ-E2473JF9 | CAP FILM 0.047UF 5% 250VDC RAD | datasheet.pdf | |
![]() | VI-J52-MZ-F1 | CONVERTER MOD DC/DC 15V 25W | datasheet.pdf | |
![]() | CBT-40-G-C21-JF201 | BIG CHIP LED HB MODULE GREEN | datasheet.pdf | |
![]() | XC6SLX100-N3FG484I | IC FPGA 326 I/O 484FBGA | datasheet.pdf | |
![]() | KTR03EZPJ512 | RES SMD 5.1K OHM 5% 1/10W 0603 | datasheet.pdf | |
![]() | ATS-20H-115-C1-R0 | HEATSINK 40X40X20MM XCUT | datasheet.pdf | |
![]() | V722125100J0G | 350 TB SOCKET WF RA | datasheet.pdf | |
![]() | VJ0805D470GXBAC | CAP CER 47PF 100V NP0 0805 | datasheet.pdf | |
![]() | 1-446080-7 | BX PIN ASSY 4 ROW 128 POS | datasheet.pdf | |
![]() | MALREKB05KK522B00K | 22000UF 6,3V 18X40 | datasheet.pdf |