Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-OMAP5910JGZG2 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Wire Bond Conversion 25/Mar/2013 | |
| PCN Packaging | 12x12 BGA Tray Change 21/Aug/2013 | |
| Standard Package | 128 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | OMAP-59xx | |
| Packaging | Tray | |
| Core Processor | ARM9TDMI | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 150MHz | |
| Co-Processors/DSP | Signal Processing; C55x, System Control; CP15 | |
| RAM Controllers | SDRAM | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | Keypad, LCD | |
| Ethernet | - | |
| SATA | - | |
| USB | USB 2.0 (2) | |
| Voltage - I/O | 1.8V, 2.75V, 3.3V | |
| Operating Temperature | -40°C ~ 85°C | |
| Security Features | - | |
| Package / Case | 289-TFBGA | |
| Supplier Device Package | 289-BGA (12x12) | |
| Additional Interfaces | 1-Wire/HDQ, AC97, I²C, I²S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | OMAP5910JGZG2 | |
| Related Links | OMAP59, OMAP5910JGZG2 Datasheet, Texas Instruments Distributor | |
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