Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-OMAP5910JGZG2 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Wire Bond Conversion 25/Mar/2013 | |
PCN Packaging | 12x12 BGA Tray Change 21/Aug/2013 | |
Standard Package | 128 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | OMAP-59xx | |
Packaging | Tray | |
Core Processor | ARM9TDMI | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 150MHz | |
Co-Processors/DSP | Signal Processing; C55x, System Control; CP15 | |
RAM Controllers | SDRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | Keypad, LCD | |
Ethernet | - | |
SATA | - | |
USB | USB 2.0 (2) | |
Voltage - I/O | 1.8V, 2.75V, 3.3V | |
Operating Temperature | -40°C ~ 85°C | |
Security Features | - | |
Package / Case | 289-TFBGA | |
Supplier Device Package | 289-BGA (12x12) | |
Additional Interfaces | 1-Wire/HDQ, AC97, I²C, I²S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | OMAP5910JGZG2 | |
Related Links | OMAP59, OMAP5910JGZG2 Datasheet, Texas Instruments Distributor |
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