Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-OPA2677HG3 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Create your power design now with TI’s WEBENCH® Designer | |
| Standard Package | 100 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | SpeedPlus™ | |
| Packaging | Tube | |
| Amplifier Type | Current Feedback | |
| Number of Circuits | 2 | |
| Output Type | - | |
| Slew Rate | 2000 V/µs | |
| Gain Bandwidth Product | 2GHz | |
| -3db Bandwidth | 250MHz | |
| Current - Input Bias | 10µA | |
| Voltage - Input Offset | 1mV | |
| Current - Supply | 18mA | |
| Current - Output / Channel | 500mA | |
| Voltage - Supply, Single/Dual (±) | 5 V ~ 12 V, ±2.5 V ~ 6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | |
| Supplier Device Package | 8-HSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | OPA2677HG3 | |
| Related Links | OPA26, OPA2677HG3 Datasheet, Texas Instruments Distributor | |
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