Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC18LF25K22T-I/SS | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | Copper Bond Wire 17/Dec/2014 | |
PCN Assembly/Origin | Mold Compound Update 30/Jul/2015 | |
PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 2,100 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® XLP™ 18K | |
Packaging | Tape & Reel (TR) | |
Core Processor | PIC | |
Core Size | 8-Bit | |
Speed | 64MHz | |
Connectivity | I²C, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | |
Number of I/O | 24 | |
Program Memory Size | 32KB (16K x 16) | |
Program Memory Type | FLASH | |
EEPROM Size | 256 x 8 | |
RAM Size | 1.5K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
Data Converters | A/D 19x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 28-SSOP (0.209", 5.30mm Width) | |
Supplier Device Package | 28-SSOP | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC18LF25K22T-I/SS | |
Related Links | PIC18LF25, PIC18LF25K22T-I/SS Datasheet, Microchip Technology Distributor |
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