Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-S9S12DG12F1MPVE | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | Copper Wirebond Material 09/Jun/2014 | |
Standard Package | 300 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | HCS12 | |
Packaging | Tray | |
Core Processor | HCS12 | |
Core Size | 16-Bit | |
Speed | 25MHz | |
Connectivity | CAN, I²C, SCI, SPI | |
Peripherals | PWM, WDT | |
Number of I/O | 91 | |
Program Memory Size | 128KB (128K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | 2K x 8 | |
RAM Size | 8K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.25 V | |
Data Converters | A/D 16x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 125°C | |
Package / Case | 112-LQFP | |
Supplier Device Package | 112-LQFP (20x20) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | S9S12DG12F1MPVE | |
Related Links | S9S12DG, S9S12DG12F1MPVE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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