Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-S9S12DG12F1MPVE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Wirebond Material 09/Jun/2014 | |
| Standard Package | 300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | HCS12 | |
| Packaging | Tray | |
| Core Processor | HCS12 | |
| Core Size | 16-Bit | |
| Speed | 25MHz | |
| Connectivity | CAN, I²C, SCI, SPI | |
| Peripherals | PWM, WDT | |
| Number of I/O | 91 | |
| Program Memory Size | 128KB (128K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 2K x 8 | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.25 V | |
| Data Converters | A/D 16x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 112-LQFP | |
| Supplier Device Package | 112-LQFP (20x20) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S9S12DG12F1MPVE | |
| Related Links | S9S12DG, S9S12DG12F1MPVE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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