NXP Semiconductors/Freescale Semiconductor, Inc. S9S12DG25F0VPVE
- Mfg. Part Number
- S9S12DG25F0VPVE
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 256KB FLASH 112LQFP
- Datasheet Download
- S9S12DG25F0VPVE.pdf
Availability of S9S12DG25F0VPVE
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 15.09450
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of S9S12DG25F0VPVE, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. S9S12DG25F0VPVE can be shipped within 24 hours after order. If you have any demands for S9S12DG25F0VPVE, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- S9S12DG25F0VPVE Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
S9S12DG25F0VPVE
| Internal Part Number | EIS-S9S12DG25F0VPVE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Wirebond Material 09/Jun/2014 | |
| Standard Package | 300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | HCS12 | |
| Packaging | Tray | |
| Core Processor | HCS12 | |
| Core Size | 16-Bit | |
| Speed | 25MHz | |
| Connectivity | CAN, I²C, SCI, SPI | |
| Peripherals | PWM, WDT | |
| Number of I/O | 91 | |
| Program Memory Size | 256KB (256K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 4K x 8 | |
| RAM Size | 12K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.25 V | |
| Data Converters | A/D 16x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 112-LQFP | |
| Supplier Device Package | 112-LQFP (20x20) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S9S12DG25F0VPVE | |
| Related Links | S9S12DG, S9S12DG25F0VPVE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
S9S12DG25F0VPVE Details Description
Related parts for S9S12DG25F0VPVE
 | RG2012V-9531-B-T5 | RES SMD 9.53K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
 | RMC36DREF-S13 | CONN EDGECARD 72POS .100 EXTEND | datasheet.pdf | |
 | ESRE181M06XB | CAP POLYMER 180UF 20% 6.3V SMD | datasheet.pdf | |
 | VI-J4L-CY-B1 | CONVERTER MOD DC/DC 28V 50W | datasheet.pdf | |
| PCA.0S.302.CLLC27 | CONN INLINE RCPT 2POS SLD CUP | datasheet.pdf | |
 | 502DCA-ABAG | OSC PROG 1.3NS 20PPM 3.2X5MM | datasheet.pdf | |
| 0385401313 | CONN PLUG 13POS PNL MNT SLDR | datasheet.pdf | |
| PPT0100GXR5VB | PRESSURE TRANSDUCER | datasheet.pdf | |
 | AT97SC3205-X3A12-10 | IC CRYPTO TPM 28TSSOP | datasheet.pdf | |
| ATS-08G-04-C1-R0 | HEATSINK 40X40X20MM XCUT | datasheet.pdf | |
| ATS-19A-36-C1-R0 | HEATSINK 36.83X57.6X11.43MM | datasheet.pdf | |
| 516D226M035JL7BE3 | 22UF 35V 5X12 85C AXI | datasheet.pdf |