Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SDIN2B2-4G-T | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,500 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NAND | |
| Memory Size | 32G (4G x 8) | |
| Speed | 50MHz | |
| Interface | SD/SPI Serial | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -25°C ~ 85°C | |
| Package / Case | 169-FBGA | |
| Supplier Device Package | 169-BGA (12x18) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SDIN2B2-4G-T | |
| Related Links | SDIN2B, SDIN2B2-4G-T Datasheet, SanDisk Distributor | |
![]() | M3YYK-1036J | IDC CABLE - MPD10K/MC10G/MPD10K | datasheet.pdf | |
![]() | MNR14E0ABJ184 | RES ARRAY 4 RES 180K OHM 1206 | datasheet.pdf | |
![]() | AGC-1-1/4-R | FUSE GLASS 1.25A 250VAC 3AB 3AG | datasheet.pdf | |
![]() | ICS853006AGLFT | IC CLK BUFFER 1:6 2GHZ 20TSSOP | datasheet.pdf | |
![]() | 72T18105L6-7BB | IC FIFO 131X18 2.5V 6-7NS 240BGA | datasheet.pdf | |
![]() | CY-192B-P-Y | SENSOR PHOTO PNP 4M 12-24V | datasheet.pdf | |
![]() | 40168-0061 | UNIVERSAL TRIM KIT 900MM X 800MM | datasheet.pdf | |
![]() | ATS-11H-87-C1-R0 | HEATSINK 35X35X20MM R-TAB | datasheet.pdf | |
![]() | ATS-01D-53-C3-R0 | HEATSINK 30X30X30MM L-TAB T412 | datasheet.pdf | |
![]() | 61202421621 | CONN HEADER 24POS 2.54 | datasheet.pdf | |
![]() | CTV07RW-17-73SB-LC | HD 38999 73C 73#23 SKT RECP | datasheet.pdf | |
![]() | MS3106A14S-2S W/P CAP | AB 4C 4#16S SKT PLUG | datasheet.pdf |