Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SP13801 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Featured Product | SESUBPANT2541 Bluetooth Low Energy Module | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | RF/IF and RFID | |
| Family | RF Evaluation and Development Kits, Boards | |
| Series | - | |
| Type | Bluetooth Low Energy (BLE) | |
| Frequency | 2.4GHz | |
| For Use With/Related Products | SESUB-PAN-T2541 | |
| Supplied Contents | Board | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SP13801 | |
| Related Links | SP1, SP13801 Datasheet, TDK Corporation Distributor | |
![]() | AD5660ARJZ-3REEL7 | IC DAC 16BIT SPI/SRL SOT23-8 | datasheet.pdf | |
![]() | RMCF1206FT267K | RES SMD 267K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | ISC1210BN22NK | FIXED IND 22NH 640MA 150 MOHM | datasheet.pdf | |
![]() | CBP-2 | Connector Barrier Block Strip 2 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | SC53-821 | FIXED IND 820UH 180MA 7.8 OHM | datasheet.pdf | |
![]() | JBXFD1J03FSSDSMR | CONN PLUG 3P INLINE SKT SLD CUP | datasheet.pdf | |
![]() | SFH11-NPPC-D10-ST-BK | Connector Header 20 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | ATS-09G-191-C2-R0 | HEATSINK 45X45X30MM R-TAB T766 | datasheet.pdf | |
| 131-6701-301 | CONN SMC JACK R/A 50OHM PCB | datasheet.pdf | ||
![]() | DC480A-A | BOARD EVAL FOR LTC3405AES6 | datasheet.pdf | |
![]() | MBA02040C3242FCT00 | RES 32.4K OHM 0.4W 1% AXIAL | datasheet.pdf | |
![]() | 5-1546963-9 | TERM BLOCK ASSY | datasheet.pdf |