Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-SP2000-0.015-00-104 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Other Related Documents | Sil-Pad Metric Configurations | |
MSDS Material Safety Datasheet | Sil-Pad 2000 MSDS | |
Standard Package | 100 | |
Category | Fans, Thermal Management | |
Family | Thermal - Pads, Sheets | |
Series | Sil-Pad® 2000 | |
Usage | TO-220 | |
Shape | Rectangle | |
Outline | 25.40mm x 19.05mm | |
Thickness | 0.015" (0.381mm) | |
Material | Silicone Elastomer | |
Adhesive | - | |
Backing, Carrier | Fiberglass | |
Color | White | |
Thermal Resistivity | 0.33°C/W | |
Thermal Conductivity | 3.5 W/m-K | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | SP2000-0.015-00-104 | |
Related Links | SP2000-0., SP2000-0.015-00-104 Datasheet, Bergquist Distributor |
![]() | 9T12062A6202CBHFT | RES SMD 62K OHM 0.25% 1/8W 1206 | datasheet.pdf | |
![]() | SAF-XC164S-16F20F BB | IC MCU 16BIT 128KB TQFP-100-16 | datasheet.pdf | |
![]() | RCC26DRXN | CONN EDGECARD 52POS DIP .100 SLD | datasheet.pdf | |
![]() | GMM44DRKI-S13 | CONN EDGECARD 88POS .156 EXTEND | datasheet.pdf | |
![]() | GMM28DTAD-S189 | CONN EDGECARD 56POS R/A .156 SLD | datasheet.pdf | |
![]() | 831090C2.AR | SNSW 10A SLDR PLAIN70500888 | datasheet.pdf | |
![]() | 433305-04-0 | Connector Barrier Block Strip 4 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | BZX84-A30,215 | DIODE ZENER 30V 250MW SOT23 | datasheet.pdf | |
![]() | 0533093071 | CONN HEADER 30POS .80MM R/A SMD | datasheet.pdf | |
![]() | 5SGXEB6R2F40I2N | IC FPGA 432 I/O 1517FBGA | datasheet.pdf | |
![]() | ATS-01B-186-C2-R0 | HEATSINK 40X40X35MM R-TAB T766 | datasheet.pdf | |
![]() | 8200-253934 | MICROPHONE | datasheet.pdf |