Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TC58BYG2S0HBAI6 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 96 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | Benand™ | |
| Packaging | Tray | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM - NAND | |
| Memory Size | 4G (512M x 8) | |
| Speed | 25ns | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 67-VFBGA | |
| Supplier Device Package | 67-VFBGA (6.5x8) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TC58BYG2S0HBAI6 | |
| Related Links | TC58BYG, TC58BYG2S0HBAI6 Datasheet, Toshiba Semiconductor & Storage Distributor | |
![]() | LTC1550LIGN | IC REG SWTCHD CAP INV ADJ 16SSOP | datasheet.pdf | |
![]() | DPF18-250FIB-C | Connector Quick Connect Receptacle 18-22 AWG 0.250" (6.35mm) Crimp | datasheet.pdf | |
![]() | GSM18DTMS | CONN EDGECARD 36POS R/A .156 SLD | datasheet.pdf | |
![]() | 171104J630N-F | CAP FILM 0.1UF 5% 630VDC RADIAL | datasheet.pdf | |
![]() | EKMA1101112 | SENSOR MOTION PIR MICRO 1UA BLK | datasheet.pdf | |
![]() | PLT0805Z4270LBTS | RES SMD 427 OHM 0.01% 1/4W 0805 | datasheet.pdf | |
![]() | RWR89N1211FSBSL | RES 1.21K OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | RWR89S71R5FSRSL | RES 71.5 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | ATS-07D-45-C2-R0 | HEATSINK 25X25X20MM L-TAB T766 | datasheet.pdf | |
![]() | S280W555-610 | 10 INCH MOUNTING TRACK | datasheet.pdf | |
![]() | APS18HPA064G-3TMW | SFD18H-M 64GB MLC ET | datasheet.pdf | |
![]() | BACC63CE12S-3S | CONN 2C 2#16S PIN PLUG | datasheet.pdf |