Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TC74LVX373FTELM | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 2,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Logic - Latches | |
| Series | TC74LVX | |
| Packaging | Tape & Reel (TR) | |
| Logic Type | D-Type Transparent Latch | |
| Circuit | 8:8 | |
| Output Type | Tri-State | |
| Voltage - Supply | 2 V ~ 3.6 V | |
| Independent Circuits | 1 | |
| Delay Time - Propagation | 6ns | |
| Current - Output High, Low | 4mA, 4mA | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 20-TSSOP (0.173", 4.40mm Width) | |
| Supplier Device Package | 20-TSSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TC74LVX373FTELM | |
| Related Links | TC74LVX, TC74LVX373FTELM Datasheet, Toshiba Semiconductor & Storage Distributor | |
![]() | MTP3S-E10-C | MULTIPLE TIE PLATE | datasheet.pdf | |
![]() | FMC44DREF-S13 | CONN EDGECARD 88POS .100 EXTEND | datasheet.pdf | |
| SI7344DP-T1-E3 | MOSFET N-CH 20V 11A PPAK SO-8 | datasheet.pdf | ||
![]() | 6104320 | CONN TERM BLK GROUND 8AWG 10MM | datasheet.pdf | |
| MS0850503F040P1C | SW SNAP ACTION MINIATURE 125V | datasheet.pdf | ||
![]() | 50003-5128ELF | 4R RA REC STB 0GP | datasheet.pdf | |
![]() | 86552008TLF | DSUB METAL BRACKET | datasheet.pdf | |
| MIKROE-1304 | BOARD ADD-ON NRF C CLICK | datasheet.pdf | ||
![]() | ABC50DCKD | CONN EDGECARD 100POS .100" | datasheet.pdf | |
![]() | TXS2-6V-1 | TX-S RELAY AGPD CONTACT | datasheet.pdf | |
![]() | BK1/S505-2.5-R | FUSE CERAMIC 2.5A 250VAC 5X20MM | datasheet.pdf | |
![]() | AD9627BCPZ-125 | 12-Bit, 80/105/125/150 MSPS, 1.8 V Dual Analog-to-Digital Converter IC | datasheet.pdf |