Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TG-NSP35-1LB | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | TG-NSP35 Non-Silicone Putty Materials | |
| Featured Product | NSP-35 One-Part Liquid Thermal Gap Filler | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Adhesives, Epoxies, Greases, Pastes | |
| Series | TG | |
| Type | Non-Silicone Putty | |
| Size / Dimension | 1 lb Can | |
| Shipping Info | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TG-NSP35-1LB | |
| Related Links | TG-NSP, TG-NSP35-1LB Datasheet, t-Global Technology Distributor | |
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