Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-TMPA900CMXBG | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | TX09 | |
Packaging | Tray | |
Core Processor | ARM9® | |
Core Size | 32-Bit | |
Speed | 200MHz | |
Connectivity | EBI/EMI, I²C, Microwire, SPI, UART/USART, USB | |
Peripherals | DMA, I²S, LCD, NAND, SD, Touch Screen, WDT | |
Number of I/O | 91 | |
Program Memory Size | - | |
Program Memory Type | ROMless | |
EEPROM Size | - | |
RAM Size | 32K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.4 V ~ 3.6 V | |
Data Converters | A/D 8x10b | |
Oscillator Type | Internal | |
Operating Temperature | -20°C ~ 85°C | |
Package / Case | 289-LFBGA | |
Supplier Device Package | 289-FBGA (15x15) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | TMPA900CMXBG | |
Related Links | TMPA90, TMPA900CMXBG Datasheet, Toshiba Semiconductor & Storage Distributor |
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