Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TMS320DM365ZCE30 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Bond Wire Update 21/Sep/2015 | |
| Manufacturer Product Page | TMS320DM365ZCE30 Specifications | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - DSP (Digital Signal Processors) | |
| Series | TMS320DM3x, DaVinci™ | |
| Packaging | Tray | |
| Type | Digital Media System-on-Chip (DMSoC) | |
| Interface | EBI/EMI, Ethernet, I²C, McBSP, SPI, UART, USB | |
| Clock Rate | 300MHz | |
| Non-Volatile Memory | ROM (16 kB) | |
| On-Chip RAM | 56kB | |
| Voltage - I/O | 1.8V, 3.3V | |
| Voltage - Core | 1.35V | |
| Operating Temperature | 0°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 338-LFBGA | |
| Supplier Device Package | 338-NFBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TMS320DM365ZCE30 | |
| Related Links | TMS320DM, TMS320DM365ZCE30 Datasheet, Texas Instruments Distributor | |
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