Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-TNPW040280K6BETD | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Featured Product | High-Stability Thin-Film Flat Chip Resistors | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 10,000 | |
Category | Resistors | |
Family | Chip Resistor - Surface Mount | |
Series | TNPW | |
Packaging | Tape & Reel (TR) | |
Resistance (Ohms) | 80.6k | |
Tolerance | ±0.1% | |
Power (Watts) | 0.063W, 1/16W | |
Composition | Thin Film | |
Features | - | |
Temperature Coefficient | ±25ppm/°C | |
Operating Temperature | -55°C ~ 125°C | |
Package / Case | 0402 (1005 Metric) | |
Supplier Device Package | 0402 | |
Size / Dimension | 0.039" L x 0.020" W (1.00mm x 0.50mm) | |
Height | 0.016" (0.40mm) | |
Number of Terminations | 2 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | TNPW040280K6BETD | |
Related Links | TNPW0402, TNPW040280K6BETD Datasheet, Vishay/Dale Distributor |
![]() | ERJ-S12F2671U | RES SMD 2.67K OHM 1% 3/4W 1812 | datasheet.pdf | |
![]() | RBA15DCBI | CONN EDGECARD 30POS R/A .125 SLD | datasheet.pdf | |
![]() | 08052C223JAT2A | CAP CER 0.022UF 200V X7R 0805 | datasheet.pdf | |
![]() | VE-JTP-MW-F1 | CONVERTER MOD DC/DC 13.8V 100W | datasheet.pdf | |
![]() | RNC60H7900BSB14 | RES 790 OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | Q2-F2XYG-3/8-08-QB6IN-16 | HEATSHRINK 3/8"-6" YLLW/GREEN | datasheet.pdf | |
![]() | SS64100-029F | CONN MOD JACK | datasheet.pdf | |
![]() | SI5330F-B00214-GM | IC CLK BUFFER 1:8 CMOS 24QFN | datasheet.pdf | |
![]() | W.FL-2LP-04N1-A-(140) | CABLE ASSEM WFL-WFL 100MM ULTRA | datasheet.pdf | |
![]() | 6717 DB005 | HU STRND 14AWG DARK BLUE 100' | datasheet.pdf | |
![]() | SO63-2-W1-24-9-100 | SOLDER SHIELD TERM 24 AWG LEAD | datasheet.pdf | |
![]() | LDB311G5010C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |