Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TSW-113-08-T-S | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Board-to-Board Connectors | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Headers, Male Pins | |
| Series | TSW | |
| Packaging | Bulk | |
| Contact Type | Male Pin | |
| Connector Type | Header, Unshrouded | |
| Number of Positions | 13 | |
| Number of Positions Loaded | All | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 1 | |
| Row Spacing | - | |
| Contact Mating Length | 0.230" (5.84mm) | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Fastening Type | - | |
| Features | - | |
| Contact Finish | Tin | |
| Contact Finish Thickness | - | |
| Color | Black | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TSW-113-08-T-S | |
| Related Links | TSW-113, TSW-113-08-T-S Datasheet, Samtec, Inc. Distributor | |
![]() | 183K28 | XFRMR LAMINATED 56VA THRU HOLE | datasheet.pdf | |
![]() | SQCAEM330JAJWE | CAP CER 33PF 150V 0605 | datasheet.pdf | |
![]() | MAX350EAP+ | IC MULTIPLEXER DUAL 4X1 20SSOP | datasheet.pdf | |
![]() | STM8S103F2P6TR | MCU 8BIT 4KB FLASH 20-TSSOP | datasheet.pdf | |
![]() | MS27467T11B99AC | CONN HSG PLUG STRGHT 7POS PIN | datasheet.pdf | |
![]() | M55342E03B5B23RWS | RES SMD 5.23K OHM 0.1% 1/5W 1005 | datasheet.pdf | |
![]() | 801-87-019-10-268101 | Connector Socket 19 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 805-87-030-10-003101 | Connector Socket 30 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | LCMA50-6-L | LUG COPPER 1 HOLE | datasheet.pdf | |
![]() | 55PC0821-16-6/9CS2688 | 55PC CABLE | datasheet.pdf | |
![]() | MAL204313101E3 | 100UF 250V 21X38MM 85C 15000H | datasheet.pdf | |
![]() | LDB311G5010C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |