Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-W972GG6JB-3 TR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | W972GG6,8JB Device 08/May/2015 | |
| Standard Package | 2,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | DDR2 SDRAM | |
| Memory Size | 2G (128M x 16) | |
| Speed | 8ns | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.9 V | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 84-TFBGA | |
| Supplier Device Package | 84-WBGA (11x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | W972GG6JB-3 TR | |
| Related Links | W972GG6, W972GG6JB-3 TR Datasheet, Winbond Electronics Corp. Distributor | |
![]() | XCV100E-7BG352I | IC FPGA 196 I/O 352MBGA | datasheet.pdf | |
![]() | A7SSB-2506M | CABLE D-SUB-AFM25B/AE25M/AFM25B | datasheet.pdf | |
![]() | MAX3232EIDW | IC RS232 3V5.5V 15KVESD 16-SOIC | datasheet.pdf | |
![]() | CDK2000-CLK/KIT2 | KIT EVAL PROTOTYPING CS2000-CP | datasheet.pdf | |
![]() | 433103-03-0 | Connector Barrier Block Strip 3 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | MCH6431-TL-H | MOSFET N-CH 30V 5A MCPH6 | datasheet.pdf | |
![]() | V24B12M150BF3 | CONVERTER MOD DC/DC 12V 150W | datasheet.pdf | |
![]() | VE-B60-MV-F4 | CONVERTER MOD DC/DC 5V 150W | datasheet.pdf | |
![]() | RNC55J1963FSB14 | RES 196K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 1898770000 | BLZ 5.00/20/90F SN BK | datasheet.pdf | |
![]() | CNX_V04_NTP | VERTICAL SINGLE ROW HDR | datasheet.pdf | |
![]() | XC2S100E-FT256I | IC FPGA 176 I/O 256FBGA | datasheet.pdf |