Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC17S10XLP8DC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC17S10XLP8DCXC2V10000-4BG575C in 1 day. | |
| Full Details | - | |
| Series | XC17S10 | |
| Lifecycle status | - | |
| RoHS Status | - | |
| HTS Code | 8542.39.00.00 | |
| Number of CLBs | - | |
| Package Code | DIP | |
| Surface Mount | SMD/Through Hole | |
| Moisture Sensitivity Level | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC17S10XLP8DC | |
| Alternative Part (Replacement) | EIS-XC17S10XLP8DC | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Product Category | Memory - Configuration Proms for FPGA | |
| Product Family | FPGA Familis | |
| Product Series Type | Memory - Configuration Proms for FPGAs | |
| Related Links | XC17S1, XC17S10XLP8DC Datasheet, Xilinx Distributor | |
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