Xilinx XC17S200APD8G8C

XC17S200APD8G8C picture photo
Mfg. Part Number
XC17S200APD8G8C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
IC PROM SER 200000 C-TEMP 8-DIP
Datasheet Download
XC17S200APD8G8C.pdf
Availability of XC17S200APD8G8C

Available Quantity

12960 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XC17S200APD8G8C, we specialize in Xilinx all series electronic components. XC17S200APD8G8C can be shipped within 24 hours after order. If you have any demands for XC17S200APD8G8C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC17S200APD8G8C Order Process
Add Parts to RFQ form
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We reply within 24 hours
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Specifications of XC17S200APD8G8C
Internal Part NumberEIS-XC17S200APD8G8C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC17S200APD8G8CXC2V10000-4BG575C in 1 day.
Full Details-
SeriesXC17S200
Lifecycle status-
RoHS Status-
HTS Code8542.39.00.00
Number of CLBs-
Package CodeDIP
Surface MountSMD/Through Hole
Moisture Sensitivity Level-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC17S200APD8G8C
Alternative Part (Replacement)EIS-XC17S200APD8G8C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Product CategoryMemory - Configuration Proms for FPGA
Product FamilyFPGA Familis
Product Series Type Memory - Configuration Proms for FPGAs
Related LinksXC17S20, XC17S200APD8G8C Datasheet, Xilinx Distributor
XC17S200APD8G8C Details Description
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