Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC7K325T-1FBG676C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions | |
| PCN Design/Specification | Zynq-7000 Datasheet Update 02/Jun/2014 | |
| PCN Assembly/Origin | Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014 | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Kintex-7 | |
| Number of LABs/CLBs | 25475 | |
| Number of Logic Elements/Cells | 326080 | |
| Total RAM Bits | 16404480 | |
| Number of I/O | 250 | |
| Number of Gates | - | |
| Voltage - Supply | 0.97 V ~ 1.03 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 676-BBGA, FCBGA | |
| Supplier Device Package | 676-FCBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC7K325T-1FBG676C | |
| Related Links | XC7K325T, XC7K325T-1FBG676C Datasheet, Xilinx Distributor | |
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