Xilinx XC7K325T-3FBG900C

XC7K325T-3FBG900C picture photo
Mfg. Part Number
XC7K325T-3FBG900C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Field Programmable Gate Array, PBGA900 IC
Datasheet Download
XC7K325T-3FBG900C.pdf
Availability of XC7K325T-3FBG900C

Available Quantity

11440 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XC7K325T-3FBG900C, we specialize in Xilinx all series electronic components. XC7K325T-3FBG900C can be shipped within 24 hours after order. If you have any demands for XC7K325T-3FBG900C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC7K325T-3FBG900C Order Process
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Specifications of XC7K325T-3FBG900C
Internal Part NumberEIS-XC7K325T-3FBG900C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC7K325T-3FBG900C today
SeriesXC7K325T-
Lifecycle statusActive
RoHS StatusRoHS compliant
HTS Code8542.39.00.01
Number of CLBs-
Number of Terminals900
Technology-
Feature-
Package Code-
Package Shape-
Package StyleGRID ARRAY Meter
Surface MountYES
Width-
Length-
Moisture Sensitivity Level4
Peak Reflow Temperature (Cel)245
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC7K325T-3FBG900C
Alternative Part (Replacement)EIS-XC7K325T-3FBG900C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC7K325T, XC7K325T-3FBG900C Datasheet, Xilinx Distributor
XC7K325T-3FBG900C Details Description
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