Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-XC7K325T-L2FBG900E | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions | |
PCN Design/Specification | Zynq-7000 Datasheet Update 02/Jun/2014 | |
PCN Assembly/Origin | Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014 | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Kintex-7 | |
Number of LABs/CLBs | 25475 | |
Number of Logic Elements/Cells | 326080 | |
Total RAM Bits | 16404480 | |
Number of I/O | 350 | |
Number of Gates | - | |
Voltage - Supply | 0.97 V ~ 1.03 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 100°C | |
Package / Case | 900-BBGA, FCBGA | |
Supplier Device Package | 900-FCBGA (31x31) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | XC7K325T-L2FBG900E | |
Related Links | XC7K325T-, XC7K325T-L2FBG900E Datasheet, Xilinx Distributor |
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