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Xilinx XC7Z035-1FBG676I

XC7Z035-1FBG676I picture photo
Mfg. Part Number
XC7Z035-1FBG676I
Manufacturer
Product Category
Embedded - System On Chip (SoC)
Brief Description
IC SOC CORTEX-A9 KINTEX7 676BGA
Datasheet Download
XC7Z035-1FBG676I.pdf
Availability of XC7Z035-1FBG676I

Available Quantity

5020 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 1.00000
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XC7Z035-1FBG676I, we specialize in Xilinx all series electronic components. XC7Z035-1FBG676I can be shipped within 24 hours after order. If you have any demands for XC7Z035-1FBG676I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC7Z035-1FBG676I Order Process
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Specifications of XC7Z035-1FBG676I
Internal Part NumberEIS-XC7Z035-1FBG676I
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Featured ProductZynq®-7 SoC
PCN Design/SpecificationZynq-7000 AP Requirement 28/Sep/2015
Standard Package1
Category Integrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
SeriesZynq®-7000
PackagingTray
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MCU Flash-
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
Operating Temperature-40°C ~ 100°C
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)XC7Z035-1FBG676I
Related LinksXC7Z035-, XC7Z035-1FBG676I Datasheet, Xilinx Distributor
XC7Z035-1FBG676I Details Description
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