Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC7Z100-1FFG900I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions | |
| Featured Product | Zynq®-7 SoC | |
| PCN Design/Specification | Zynq-7000 Datasheet Update 02/Jun/2014 Zynq-7000 AP Requirement 28/Sep/2015 | |
| PCN Assembly/Origin | Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014 | |
| Standard Package | 27 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | Zynq®-7000 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| MCU Flash | - | |
| MCU RAM | 256KB | |
| Peripherals | DMA | |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Speed | 667MHz | |
| Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 900-BBGA, FCBGA | |
| Supplier Device Package | 900-FCBGA (31x31) | |
| Number of I/O | 212 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC7Z100-1FFG900I | |
| Related Links | XC7Z100-, XC7Z100-1FFG900I Datasheet, Xilinx Distributor | |
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