Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XCV1000E-6FG860C | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Virtex®-E | |
| Number of LABs/CLBs | 6144 | |
| Number of Logic Elements/Cells | 27648 | |
| Total RAM Bits | 393216 | |
| Number of I/O | 660 | |
| Number of Gates | 1569178 | |
| Voltage - Supply | 1.71 V ~ 1.89 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 860-BGA | |
| Supplier Device Package | 860-FBGA (42.5x42.5) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XCV1000E-6FG860C | |
| Related Links | XCV1000E, XCV1000E-6FG860C Datasheet, Xilinx Distributor | |
![]() | GBC05DRTN | CONN EDGECARD 10POS DIP .100 SLD | datasheet.pdf | |
| TLC2252CPW | IC OPAMP GP 210KHZ RRO 8TSSOP | datasheet.pdf | ||
![]() | NLU1GT126BMX1TCG | IC BUFF TRI-ST TTL N-INV 6ULLGA | datasheet.pdf | |
![]() | 72V3670L10PF | IC FIFO SYNC II 36BIT 128-TQFP | datasheet.pdf | |
![]() | VE-23H-MW-F2 | CONVERTER MOD DC/DC 52V 100W | datasheet.pdf | |
![]() | 0011210120 | AM2161SC1546 SPRING | datasheet.pdf | |
![]() | HMC493LP3E | IC DIVIDER X4 PRESCALER 16-QFN | datasheet.pdf | |
![]() | GRO040061A | GROMMET 0.281" PVC BLACK | datasheet.pdf | |
| 501MCG-ADAG | OSC PROG 2.5NS 20PPM 2X2.5MM | datasheet.pdf | ||
![]() | 2420/29 GY-100 | ULTRA-FLEX FEP 29 AWG 100 FT GY | datasheet.pdf | |
![]() | VJ0402D4R3DLBAC | CAP CER 4.3PF 100V NP0 0402 | datasheet.pdf | |
![]() | CTA-0103 | BUSBARS | datasheet.pdf |