Xilinx XCZU19EG-3FFVD1760I

XCZU19EG-3FFVD1760I picture photo
Mfg. Part Number
XCZU19EG-3FFVD1760I
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Microprocessor Circuit, CMOS, PBGA1760 IC
Datasheet Download
XCZU19EG-3FFVD1760I.pdf
Availability of XCZU19EG-3FFVD1760I

Available Quantity

14360 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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EIS Components is the stocking Distributor of XCZU19EG-3FFVD1760I, we specialize in Xilinx all series electronic components. XCZU19EG-3FFVD1760I can be shipped within 24 hours after order. If you have any demands for XCZU19EG-3FFVD1760I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCZU19EG-3FFVD1760I Order Process
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Specifications of XCZU19EG-3FFVD1760I
Internal Part NumberEIS-XCZU19EG-3FFVD1760I
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCZU19EG-3FFVD1760I today
SeriesXCZU19EG-3
Lifecycle statusActive
RoHS StatusRoHS compliant
HTS Code8542.31.00.01
Number of CLBs-
Number of Terminals1760
TechnologyCMOS
Feature-
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width42.5 mm
Length42.5 mm
Moisture Sensitivity Level-
Peak Reflow Temperature (Cel)-
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCZU19EG-3FFVD1760I
Alternative Part (Replacement)EIS-XCZU19EG-3FFVD1760I
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCZU19EG-, XCZU19EG-3FFVD1760I Datasheet, Xilinx Distributor
XCZU19EG-3FFVD1760I Details Description
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