Xilinx XCZU19EG-3FFVD1760I
- Mfg. Part Number
- XCZU19EG-3FFVD1760I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA1760 IC
- Datasheet Download
- XCZU19EG-3FFVD1760I.pdf
Availability of XCZU19EG-3FFVD1760I
Available Quantity
14360 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU19EG-3FFVD1760I, we specialize in Xilinx all series electronic components. XCZU19EG-3FFVD1760I can be shipped within 24 hours after order. If you have any demands for XCZU19EG-3FFVD1760I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU19EG-3FFVD1760I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU19EG-3FFVD1760I
| Internal Part Number | EIS-XCZU19EG-3FFVD1760I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU19EG-3FFVD1760I today | |
| Series | XCZU19EG-3 | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 1760 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | - | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU19EG-3FFVD1760I | |
| Alternative Part (Replacement) | EIS-XCZU19EG-3FFVD1760I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU19EG-, XCZU19EG-3FFVD1760I Datasheet, Xilinx Distributor | |
XCZU19EG-3FFVD1760I Details Description
Related parts for XCZU19EG-3FFVD1760I
 | NTCG104LH104HT1 | THERMISTOR NTC 100K OHM 3% 0402 | datasheet.pdf | |
 | CY8C24223A-12PVXET | IC MCU 4K FLASH 256B SRAM 20SSOP | datasheet.pdf | |
 | RSM43DTBS-S189 | CONN EDGECARD 86POS R/A .156 SLD | datasheet.pdf | |
| AGM30DRST-S288 | CONN EDGECARD EXTEND 60POS .156 | datasheet.pdf | |
| CWH-ETP-ONCE-YE | KIT ETHERNET TAP PROBE TIP ONCE | datasheet.pdf | |
 | UB3C-1RF1 | RES 1 OHM 3W 1% AXIAL | datasheet.pdf | |
| 301A034-3/86-0 | BOOT MOLDED | datasheet.pdf | |
| CA3106F18-8S | CONN PLUG 8POS INLINE W/SKTS | datasheet.pdf | |
 | VI-J1W-MY-F1 | CONVERTER MINIMOD DC/DC 5.5V 50W | datasheet.pdf | |
 | CY7C1270XV18-600BZXC | IC SRAM 36MBIT 600MHZ 165FBGA | datasheet.pdf | |
 | HF1008R-100M | FIXED IND 10NH 1.235A 80 MOHM | datasheet.pdf | |
| XC7372-12PC84I | OT PLD, 28ns, 72-Cell, CMOS, PQCC84 IC | datasheet.pdf |