Eutelsat and OneWeb merge
Eutelsat and OneWeb are to combine with OneWeb shareholders holding 50% of Eutelsat.
This article was posted on Aug 1, 2022Biden pushes for Chips Act
Yesterday US President Joe Biden had a virtual meeting on the Chips Act with the CEOs of Lockheed Martin, Cummins and Medtronic and Commerce Secretary Gina Raimondo.
This article was posted on Aug 1, 2022External antenna Bluetooth 5 LE module for difficult enclosures
Panasonic has introduced an external antenna Bluetooth 5 Low Energy (LE) module for use in shielded housings and enclosures.
This article was posted on Aug 1, 2022Satellite Vu commissions SSTL for satellite clone to double climate data collection
The UK thermal infrared satellite firm Satellite Vu is looking to double its climate data collection capacity, it has announced.
This article was posted on Jul 29, 2022OEMs report chip supplies easing
Hyundai, Electrolux, Nokia and ABB have nade positive statements on chip supplies.
This article was posted on Jul 29, 2022Samsung asks for planning permission for 11 fabs in Texas
Samsung has asked for planning permission for 11 fabs in Texas – two in Austin and nine in Taylor – which would involve a total outlay of about $200 billion.
This article was posted on Jul 29, 2022Elektra Awards 2022 – Calling Design Engineers
The recently extended Elektra Awards entry deadline is closing on 28 July, so time is running out to submit an entry for this year.
This article was posted on Jul 29, 2022IQM raises €128m Series A2
IQM, the Espoo quantum computer developer, has raised a €128 million Series A2 funding round.
This article was posted on Jul 29, 2022Raytheon Intelligence & Space wins contract for NextGen Weather Processor
Raytheon Intelligence & Space has been awarded a $21.7m contract by the U.S. Federal Aviation Administration (FAA) to replace U.S. legacy weather systems with the NextGen Weather Processor (NWP) programme.
This article was posted on Jul 29, 2022SMIC shipping 7nm ICs
SMIC has been shipping a 7nm chip for a year, says TechInsights which has reverse engineered the device and says “initial images suggest it is a close copy of TSMC 7nm process technology.”
This article was posted on Jul 29, 2022Glasgow University team win satellite design competition
A team from Glasgow University has won £600,000 in a competition to design a satellite.
This article was posted on Jul 29, 2022Eutelsat expected to take over OneWeb this week
Eutelsat, the French satellite operator, is expected to announce a merger with OneWeb this week
This article was posted on Jul 29, 2022CEM Nemco joins Manufacturing Assembly Network
Contract electronics manufacturer Nemco has joined the Manufacturing Assembly Network (MAN), the collective of eight sub-contract manufacturers and and an engineering design agency.
This article was posted on Jul 29, 2022EW BrightSparks 2022 profile: Charlotte Fitzpatrick
Now in its fifth year of awards, EW BrightSparks sees Electronics Weekly partner with RS Grass Roots to highlight the brightest and most talented young engineers in the UK today.
This article was posted on Jul 28, 2022Astraius propulsion deals boost Scottish space launches
Astraius, the UK-based horizontal launch company due to operate out of Scotland, has announced Northrop Grumman and Exquadrum as its key propulsion suppliers.
This article was posted on Jul 28, 2022US chip companies account for 56% of global R&D spend
US chip vendors continued to dominate R&D spending in 2021, says IC Insights, while companies in Asia-Pac accounted for nearly one-third.
This article was posted on Jul 28, 2022SkyWater to build $1.8bn IC R&D facility at Purdue
SkyWater, the Minnesota hi-rel fab – plans to invest $1.8 billion for an IC R&D research facility in Indiana, in partnership with the state and Purdue University.
This article was posted on Jul 28, 2022ST and VW hook up on ICs
ST and VW’s software unit Cariad are joining up to co-design automotive chips and are “moving to agree” that TSMC will fab them
This article was posted on Jul 28, 2022Samsung upgrades SmartSSD
Samsung has upgraded its SmartSSD which processes data directly, thereby minimising data transfers between the CPU, GPU and RAM.
This article was posted on Jul 28, 2022ASML warns about supply chain effects if DUV shipments to China are stopped
ASML, which is coming under US pressure to stop selling DUV litho tools to China, says doing so could affect workwide IC supply chains.
This article was posted on Jul 28, 2022Hynix postpones NAND fab extension
Hynix has postponed a$3.3 billion expansion of its NAND fab in the Korean city of Cheongju in response to an over-supplied market, lagging demand and diving prices.
This article was posted on Jul 28, 2022